Sang Ki Son, Yoo Yong Lee, Byung Won Cho, Jae Bong Lee, Tae Hee Lee손상기, 이유용, 조병원, 이재봉, 이태희
Department of Chemical Engineering, Yonsei University, Seoul 120-749, Korea
Department of Metallurgy & Materials Engineering, Kookmin University, Seoul 136-702, Korea
Nano Eco Research Center, KIST, P.O.Box 131, Sungbuk, Seoul, 136-650, Korea연세대학교 화학공학과, 국민대학교 금속공학과, 한국과학기술연구원 나노환경연구센터
The eletrochemical charateristics of mercapto compound additives on the copper electroplating for semi
conductor metalization were investigated. Mercapto compounds including sulfur atom is known that they activate deposition
rate in eletroplating. Four di
Keyword : EQCM, Additive, Electroplating, Cathodic polarization