Yu Yong Lee, Young-Joon Park, Jae-Bong Lee, and Byung Won Cho
Eco-Nano Research Center, Korea Institute of Science and Technology, Seoul 130-650, Korea
Nano Device Research Center, Korea Institute of Science and Technology, Seoul 130-650, Korea
School of Metallurgy Materials Engineering, Kookmin University 861-1,
The effects of leveler on the copper trench filling were investigated during damascene plating process.
To investigate the trench filling effect with the addition of a leveler, a cross-section images of the electroplated
trenches with the width of 0.37 mm
Keyword : electroplating, leveler, damascene, void, superfilling