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Vol.5, No.3, August 2002

Effects of Leveler on the Trench Filling during Damascene Copper Plating전해전착시 상감 구리 배선의 충전에 미치는 레벨러의 효과
JKES Vol.5, No.3, pp.153~158, August 2002
DOI : 10.5229/JKES.2002.5.3.153
Yu Yong Lee, Young-Joon Park, Jae-Bong Lee, and Byung Won Cho
Eco-Nano Research Center, Korea Institute of Science and Technology, Seoul 130-650, Korea Nano Device Research Center, Korea Institute of Science and Technology, Seoul 130-650, Korea School of Metallurgy  Materials Engineering, Kookmin University 861-1,
The effects of leveler on the copper trench filling were investigated during damascene plating process. To investigate the trench filling effect with the addition of a leveler, a cross-section images of the electroplated trenches with the width of 0.37 mm
Keyword : electroplating, leveler, damascene, void, superfilling

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