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한국전기화학회 한국전기화학회

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Vol.13, No.4, November 2010

Pore Gradient Nickel-Copper Nanostructured Foam Electrode기공 경사화된 나노 구조의 니켈-구리 거품 전극
JKES Vol.13, No.4, pp.270~276, November 2010
DOI : 10.5229/JKES.2010.13.4.270
Woo-Sung Choi, Heon-Cheol Shin최우성, 신헌철
School of Materials Science and Engineering, Pusan National University, Busan 609-735, Republic of Korea부산대학교 재료공학부
Nickel-copper foam electrodes with pore gradient micro framework and nano-ramified wall have been prepared by using an electrochemical deposition process. Growth habit of nickel-copper co-deposits was quite different from that of pure nickel deposit. In p
Keyword : Co-deposition, Metallic foam, Porous structure, Ni-Cu alloy, Hydrogen evolution

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