Woo-Sung Choi, Heon-Cheol Shin최우성, 신헌철
School of Materials Science and Engineering, Pusan National University, Busan 609-735, Republic of Korea부산대학교 재료공학부
Nickel-copper foam electrodes with pore gradient micro framework and nano-ramified
wall have been prepared by using an electrochemical deposition process. Growth habit of
nickel-copper co-deposits was quite different from that of pure nickel deposit. In p
Keyword : Co-deposition, Metallic foam, Porous structure, Ni-Cu alloy, Hydrogen evolution